Qualcomm HBC technology completes validation: 133 TB/s memory bandwidth 18 times that of AI200, AI250 to be shown next year

Qualcomm's HBC technology has completed hardware validation at its San Diego lab. Its first-generation solution provides 133 TB/s memory bandwidth for the AI250 accelerator card, an 18-fold increase over the AI200. This architecture achieves near-memory computing through multi-layer LPDDR memory stacking and is planned to be samples in the first half of 2027.