MediaTek recruits former Intel executive to deepen AI chip packaging strategy

MediaTek has recruited Navid Shahriari, a former Intel executive with 37 years of experience, as Senior Vice President to oversee advanced packaging and testing. The core task is to deepen cooperation with TSMC to promote the CoWoS+EMIB dual-track packaging strategy, and to strengthen the product capabilities of AI chips. MediaTek's first AI ASIC product will start shipping in September 2026, with estimated revenue of $2.5 billion in the fourth quarter, aiming for $16 billion in revenue and a 20% market share in 2027.