Samsung Electronics plans to produce HBM-based wafers for clients such as AMD at its second semiconductor plant in Taylor, USA.

Samsung Electronics plans to produce HBM-based wafers for clients such as AMD at its second semiconductor plant in Taylor, USA, which began construction this month and is expected to start operations in 2030. Previously, Samsung primarily supplied such wafers to its own memory business, but starting from the HBM4 generation, memory manufacturers have begun ordering them from external advanced process foundries due to performance requirements. In addition to AMD, the industry believes that the HBM-based wafers produced at this semiconductor plant may also be used for the AI ASICs created for clients by Broadcom.