Nvidia has provided billions of dollars in support for TSMC to expand its CoWoS advanced packaging.

NVIDIA is providing billions of dollars in support for TSMC's expansion of CoWoS packaging capacity under its subsidiary TSMC Advanced Packaging, for the expansion of new clean room facilities and equipment procurement. TSMC is forcing chip design companies to seek external support due to capacity constraints, and CoWoS technology has been widely adopted by NVIDIA, AMD, Broadcom, and cloud giants.